Universal Partners with NextFlex to Deliver Advanced Packaging Technology to Binghamton University
April 14, 2022 | Universal InstrumentsEstimated reading time: 2 minutes
Universal Instruments held a ribbon-cutting ceremony for Binghamton University’s acceptance of the company’s High-Speed Wafer Feeder (HSWF) on April 5 at Universal’s corporate headquarters in Conklin, NY. The ceremony included representatives from Universal, Binghamton University and NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute.
For several years, Universal has engaged in a technology roadmap partnership with NextFlex – a consortium of American electronics companies, academic institutions, non-profits, and government partners with the shared goal of advancing U.S. manufacturing of Flexible Hybrid Electronics (FHE). NextFlex has been an important contributor in the development of Universal’s HSWF, helping bring this innovative new product to market. The project was also supported with matching funds from New York State Empire State Development via the Upstate Revitalization Initiative.
Scott Miller, NextFlex Director of Technology, noted, “We’re very happy to be working with Universal on the High-Speed Wafer Feeder and couldn’t be more pleased with the results. The FuzionSC™ Platform and HSWF solution in our advanced lab empowers us to take on the most challenging FHE applications with capabilities that break traditional barriers.”
Under the direction of NextFlex, the HSWF will be installed on the FuzionSC in Binghamton University's Smart Electronics Manufacturing Laboratory (SEMLab) at Binghamton University. The university has owned the FuzionSC for more than three years and worked closely with Universal in leveraging its capabilities to enrich the student experience and collaboration with industry partners.
“The addition of the High-Speed Wafer feeder enables us to give our students unique hands-on experience with the assembly of sophisticated multi-die Heterogeneous Integration (HI) packages, which are created by integrating separately manufactured components into a higher-level assembly. It also allows us to handle very thin die, which is another major challenge facing manufacturers today,” said Dr. Mark Poliks, Director of the Center for Advanced Microelectronics Manufacturing (CAMM), Binghamton University. “It’s been a valuable asset to partner with a leading technology company in our own backyard and we look forward to continued cooperation and knowledge sharing.”
Universal Instruments Vice President of Marketing, Glenn Farris stated, “We achieved our objective in creating an all-in-one solution for HI and our technology collaborations were key in realizing our vision. We’re pleased to introduce it to our local University and help build the future of electronics assembly.” Farris added, “This solution will also support the manufacturers that will benefit from the upcoming CHIPs Act, which came about due to a severe shortage of semiconductor chips and includes $52 billion for domestic semiconductor production.”
Suggested Items
Sypris Reports Q1 2024 Results; Revenue Up 10%
05/15/2024 | Sypris Solutions Inc.The Company’s first quarter 2024 consolidated revenue increased 10.1% to $35.6 million compared with the prior-year quarter, representing the 11th quarter of double-digit year-over-year growth during the past 12 quarterly periods.
SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
05/15/2024 | BUSINESS WIRESMTC Corporation, a leading North American provider of electronics manufacturing services, is pleased to announce the appointment of Mike Buseman as President & Chief Executive Officer, effective May 13, 2024.
Kimball Electronics Thailand Helps Save Lives by Hosting a Blood Drive
05/14/2024 | Kimball ElectronicsKimball Electronics Thailand employees took part in a blood donation event. The blood drive took place in the Rajapruek Building at Laem Chabang Industrial Estate Office.
ACDi Expands East Coast Presence with Acquisition of Fourth Manufacturing Plant
05/13/2024 | ACDiACDi, a leading provider of electronics manufacturing services, today announces the expansion of its East Coast presence and manufacturing capabilities with the acquisition of a fourth manufacturing plant in Kilmarnock, Virginia. The company signed an asset purchase agreement with QinetiQ to acquire their Virginia facility and its assets, including SMT, wave soldering, AOI and SPI equipment. The deal brings ACDi to 4 East Coast locations with a total of 9 SMT lines.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.